Leadframe with pad anchoring members and method of forming the same

ABSTRACT

A leadframe having extensions around an outer edge of a die pad are disclosed. More specifically, leadframes are created with a flange formed at the outer edge of the die pad and extending away from the die pad. The flange is bent, such that it is positioned at an angle with respect to the die pad. Leadframes are also created with anchoring posts formed adjacent the outer edge of the die pad and extending away from the die pad. The anchoring posts have a central thickness that is less than a thickness of first and second portions opposite the central portion. When the leadframe is incorporated into a package, molding compound completely surrounds each flange or anchoring post, which increases the bond strength between the leadframe and the molding compound due to increased contact area. The net result is a reduced possibility of delamination at edges of the die pad.

BACKGROUND Technical Field

The present disclosure is directed to a leadframe having extensionsaround a die pad that are at an angle with respect to a surface of thedie pad.

Description of the Related Art

Quad flat no-lead (“QFN”) packages are common in the packaging spacebecause of their small size and excellent performance for manyapplications. These packages include leadframes where a back surface ofa die pad is exposed on a back of the package. Leads are also exposed onthe back of the package and are spaced from, and surround the die pad.Within the package, the leadframes support a die in a central positionand often include wire bonds from the die to the leads. During packagemanufacturing, molding compound, or sealant, is formed over the die, thewires, and the leadframe to complete the package. The primary purpose ofthe molding compound is to protect the electrically active componentscontained within the package.

However, such packages are often susceptible to cracking, which leads topackage failure when water or other contaminants are allowed to enterthe package through the crack. In particular, cracks are most likely toform at edges of the die pad because those areas experience the highestamount of stress due to expansion and contraction of the leadframeduring use, as described below.

In an attempt to remedy this undesirable outcome, some packages includea die pad with an outer edge, wherein a recess is etched or otherwiseformed under one or more edges. In such packages, a plane defined by thefront surface of the die pad is coplanar with a plane defined by a topsurface of the leads. When the molding compound is formed, the moldingcompound occupies the recess so as to form a seal between the moldingcompound and the leadframe.

But, this solution overlooks the fact that the coefficients of thermalexpansion, or the rate at which a size of an object changes inrelationship to temperature, are different for the metal of theleadframe and the molding compound. As such, when the package enduresrepeated heating and cooling cycles during use, the metal that comprisesthe leadframe will expand and contract much more quickly than thesurrounding molding compound. This cycle will eventually cause theleadframe to delaminate, or separate, from the molding compound, whichforms a crack. These cracks are much more common at the outer edges ofthe die pad, as these areas of the die pad are in direct contact withthe molding compound and experience the largest amount of stress andmovement due to the expansion and contraction of the die pad. Asdescribed above, cracking of this nature is a common source of packagefailure. Therefore, there remains a need for a leadframe with padanchoring members that more effectively seal the package, thus furtherpreventing the possibility of package delamination or cracking.

In addition, in the packaging space, there is an ever-present need forproducing smaller packages, as attempts continue to be made to producesmaller and sleeker user devices incorporating the packages. As such,there is a particular need for smaller or thinner packages withincreased performance and a reduced possibility of package delamination.

BRIEF SUMMARY

The exemplary embodiments in the present disclosure are directed toimproving reliability of integrated circuit packages by reducing thepossibility of cracks forming between an edge of a leadframe and amolding compound surrounding the leadframe in the package.

In one exemplary embodiment, a leadframe is formed with a centrallylocated die pad. The die pad has a first, or front, surface and an outeredge bounding the first surface. A flange is formed next to the outeredge of the die pad and extends away from the outer edge. In otherwords, the flange has a height that is greater than a thickness of thedie pad. The flange is also bent towards a center of the die pad, suchthat a plane defined by a second, or top, surface of the flange ispositioned at an angle with respect to the first surface of the die pad.In some embodiments, this angle is any angle that is not parallel to thefirst surface of the die pad. In other embodiments, this angle is at asubstantially perpendicular angle. The leadframe can further beincorporated into a package by coupling a die to the die pad, andbonding one or more wires between the die and leads of the leadframe.Then, a molding compound is formed over the die, the wires, and theleadframe to create the package. The molding compound completelysurrounds the flange, thus providing a strong bond between the moldingcompound and the leadframe, which reduces the possibility of a crack atthe outer edge of the die pad.

In a second exemplary embodiment, a method of forming such a leadframeis described. The method begins with a flat sheet of material. A firstrecess and a die pad are formed in a first surface of the sheet. Thisforming process includes defining the flange between the first recessand the die pad. Then, the die pad and the flange are separated fromleads by forming a second recess in a second surface of the sheet. Thesecond recess is aligned with the first recess and cooperates with thefirst recess to define a space, or gap, between the flange and eachlead. Then, the flange is bent towards the center of the die pad, whichpositions a first surface of the flange at an angle with respect to thefirst surface of the die pad, as described above. A package is formed byfollowing the above steps, including coupling a die to the die pad,bonding wires between the die and the leads, and forming a moldingcompound over the die, the wires, and the leadframe. Forming the moldingcompound includes completely surrounding each of the flanges, whichprevents the leadframe from separating from the molding compound.

In a third exemplary embodiment, a leadframe includes a die pad with anouter edge having multiple flanges. Each flange is separated by a recessformed in the outer edge, such that the outer edge of the die pad has aserrated shape or configuration. This leadframe can be combined into apackage as described above, with molding compound surrounding each ofthe flanges.

In a fourth exemplary embodiment, a leadframe is formed with a centraldie pad spaced from multiple leads. Further, multiple anchoring postsare formed on, and extend from, an outer edge of the die pad. Eachanchoring post includes a first portion and a second portion with acentral portion between the first and second portions. Sidewalls of theanchoring posts have a concave or convex shape, such that a thickness ofthe first and second portions may be greater than, or less than, athickness of the central portion. When the leadframe is incorporatedinto a package, molding compound surrounds each of the anchoring posts.The anchoring posts provide for increased contact surface between themolding compound and the leadframe, thus forming a stronger bond andreducing the possibility of package failure.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

For a better understanding of the embodiments, reference will now bemade by way of example only to the accompanying drawings. In thedrawings, identical reference numbers identify similar elements or acts.The sizes and relative positions of elements in the drawings are notnecessarily drawn to scale. For example, the shapes of various elementsand angles are not necessarily drawn to scale, and some of theseelements may be enlarged and positioned to improve drawing legibility.Further, the particular shapes of the elements as drawn, are notnecessarily intended to convey any information regarding the actualshape of the particular elements, and may have been solely selected forease of recognition in the drawings.

FIG. 1A is a top down view of an exemplary embodiment of a leadframeaccording to the present disclosure having a first flange extending froma first outermost edge of a die pad;

FIG. 1B is a cross-sectional view of the leadframe of FIG. 1A showingthe leadframe incorporated into a package and the first flange in moredetail;

FIGS. 2A-2F are cross-sectional views of an exemplary method of formingthe leadframe of FIG. 1A;

FIG. 3 is a cross-sectional view of an alternative exemplary embodimentaccording to the present disclosure showing the first flange in analternative configuration;

FIG. 4 is a top-down view of an alternative exemplary embodiment of aleadframe according to the present disclosure having a die pad with anserrated outermost edge and a plurality of flanges formed adjacent tothe outermost edge;

FIG. 5A is top-down view of an alternative exemplary embodiment of aleadframe according to the present disclosure having a plurality ofanchoring posts spaced along an outermost edge of a die pad;

FIG. 5B is a cross-sectional view of the leadframe of FIG. 5A showingthe plurality of anchoring posts in more detail;

FIG. 5C is a partial perspective view of a portion of the leadframe ofFIG. 5A showing the plurality of anchoring posts in more detail; and

FIG. 5D is a partial cross-sectional view of a tie bar of the leadframeof FIG. 5A showing the connection to the die pad in more detail.

DETAILED DESCRIPTION

In the following description, certain specific details are set forth inorder to provide a thorough understanding of various disclosedembodiments. However, one skilled in the relevant art will recognizethat embodiments may be practiced without one or more of these specificdetails, or with other methods, components, materials, etc. In otherinstances, well-known structures associated with leadframes and chippackaging have not been shown or described in detail to avoidunnecessarily obscuring descriptions of the embodiments.

Unless the context requires otherwise, throughout the specification andclaims which follow, the word “comprise” and variations thereof, suchas, “comprises” and “comprising” are to be construed in an open,inclusive sense, that is as “including, but not limited to.” Further,the terms “first,” “second,” and similar indicators of sequence are tobe construed as interchangeable unless the context clearly dictatesotherwise.

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure or characteristicdescribed in connection with the embodiment is included in at least oneembodiment. Thus, the appearances of the phrases “in one embodiment” or“in an embodiment” in various places throughout this specification arenot necessarily all referring to the same embodiment. Furthermore, theparticular features, structures, or characteristics may be combined inany suitable manner in one or more embodiments.

As used in this specification and the appended claims, the singularforms “a,” “an,” and “the” include plural referents unless the contentclearly dictates otherwise. It should also be noted that the term “or”is generally employed in its broadest sense, that is as meaning “and/or”unless the content clearly dictates otherwise.

The present disclosure is directed to improving reliability of packagescontaining leadframes by providing a leadframe with a die pad having oneor more pad anchoring members to improve the bond between the leadframeand a molding compound formed over the leadframe, thus reducing thepossibility of a package crack.

FIGS. 1A-B are an exemplary embodiment of the present disclosure showinga top-down view, and a cross-sectional view, respectively, of aleadframe 100 in various stages of manufacturing. In this embodiment,the leadframe 100 includes a plurality of leads 102 spaced from a diepad 104 having a first surface 119 opposite a second surface 121. Thesecond surface 121 is shown in more detail with reference with to FIG.1B. The leadframe 100 has a rectangular shape with a first edge 103, asecond edge 105, a third edge 107, and a fourth edge 109. The pluralityof leads 102 are spaced around the first, second, third and fourth edges103, 105, 107, 109 of the leadframe 100. In some embodiments theplurality of leads 102 includes twelve leads 102 spaced equidistant fromeach other, with an identical number of leads 102 on each edge 103, 105,107, 109 of the leadframe 100. However, other embodiments may includefewer, or more leads 102 with different spacing and arrangement in orderto suit particular package requirements.

The die pad 104 similarly has a rectangular shape with a first side 106,a second side 108, a third side 110, and a fourth side 112. Each of thefirst side 106, the second side 108, the third side 110, and the fourth112 include an outermost edge of the die pad 104. For example, the firstside 106 includes first outermost edge 114, the second side 108 includessecond outermost edge 116, the third side 110 includes third outermostedge 118, and the fourth side includes fourth outermost edge 120.However, one of skill in the art will appreciate that the die pad 104and the leadframe 100 can be formed to have alternate shapes, forexample a circle, in which case the die pad 104 would have a singularoutermost edge.

The die pad 104 is coupled to the edges 103, 105, 107, and 109 of theleadframe 100 by a first bar 111, a second bar 113, a third bar 115, anda fourth bar 117. In this embodiment, the bars 111, 113, 115, and 117are tie bars. The bars 103, 105, 107 and 109 provide support to the diepad 104 while the leadframe 100 undergoes further processing, such ascoupling a die to the die pad 104 or bonding wires between the die andthe leads 102. Such processes are described in more detail below.

When the leadframe 100 is incorporated into a package, as describedherein, the die pad 104 is electrically isolated from the plurality ofleads 102 by removing an outermost portion 126 of the leadframe 100along line 127. The outermost portion 126 may be removed by any numberof conventional processes, such as wet or dry etching, sawing with amechanical blade, stamping, or laser processing, for example. Further,although FIG. 1A illustrates only one such outermost portion 126 beingremoved, one of skill in the art will appreciate that an outermostportion can be removed from each edge 103, 105, 107, 109 of theleadframe 100 in a similar manner to electrically isolate the die pad104 from the plurality of leads 102.

In addition, the size of the outermost portion 126 to be removed fromthe leadframe 100 for electric isolation may vary to suit the packagerequirements. In other words, the line 127 may be moved closer to theedge 105, or closer to the die pad 104, such that varying portions 126are removed when incorporating the leadframe 100 into a package. In anembodiment, the portions to be removed along each edge 103, 105, 107,109 are the same, while in other embodiments, the portions aredifferent. In yet a further embodiment, the portions to be removedinclude removing a portion of each tie bar 111, 113, 115, 117.

The leadframe 100 further includes a first flange 130 extending from thefirst outermost edge 114 of the first side 106 of the die pad 104.Similarly, the leadframe 100 includes a second flange 132 extending fromthe second outermost edge 116 of the second side 108 of the die pad 104,a third flange 134 extending from the third outermost edge 118 of thethird side 110 of the die pad 104, and fourth flange 136 extending fromthe fourth outermost edge 120 of the fourth side 112 of the die pad. Thefirst flange 130 is shown in more detail in the cross-sectional view ofFIG. 1B.

FIG. 1B shows a cross-sectional view of the die pad 104 and the leads102 along the line 1B in FIG. 1A, wherein the die pad 104 and the leads102 are incorporated into a package 138. In some instances, the package138 is a QFN package. The package 138 further includes a die 140 coupledto the first surface 119 of the die pad 104 by a tape or glue 142. Thepackage 138 also includes a plurality of wires 146 coupled between thedie 140 and the leads 102. The coupling between the wires 146 and thedie 140 may be accomplished via one or more electrical contacts 148,which may be pillars or solder bumps extending from the die 140 and oneor more contact pads or lands 150 on the leads 102. A molding compound152 is then formed over the leadframe 100, the die pad 104, the leads102, the die 140, and the plurality of wires 146 to form the package138.

FIG. 1B also shows the first flange 130 and the third flange 134 in moredetail. The first flange 130 includes a first portion 154 coupled to thefirst side 106 of the die pad 104. In this embodiment, the first portion154 of the first flange 130 is coupled to the first side 106 at thefirst outermost edge 114 of the die pad 104. The first flange 130extends from the first outermost edge 114 and away from the firstsurface 119 of the die pad 104. The first flange 130 further includes asecond portion 156 coupled to, and extending from, the first portion154. The first and second portions 154, 156 may be a single unitarymaterial that is contiguous with the die pad.

The second portion 156 includes a third surface 158. A plane 160 of thethird surface 158, or defined by the third surface 158, is positioned atan angle with respect to the first surface 119 of the die pad 104. Inother words, the first flange 130 is bent after forming, which not onlypositions the plane 160 of the third surface 158 at an angle withrespect to the first surface 119 of the die pad 104, but it is alsoraises the first flange 130 from the second surface 121, such that acavity 162 is defined or formed between an edge 164 of the first portion154 of the first flange 130 and a plane of the second surface 121 of thedie pad 104. When the leadframe 100 is incorporated into a package withmolding compound as described below, the molding compound 152 is in thecavity 162.

In some embodiments, the angle of the plane 160 of the third surface 158with respect to the first surface 119 of the die pad 104 is a transverseangle, which is any angle that is not parallel to the first surface 119.In other embodiments, the angle of the plane 160 of the third surface158 with respect to the first surface 119 of the die pad 104 is asubstantially perpendicular angle. This latter arrangement is describedin more detail below with reference to FIG. 3. Although only thefeatures of the first flange 130 are described in detail herein, it isto be understood that each of the second, third, and fourth flanges 132,134, and 136 can be formed to have similar or different characteristicsin comparison for the first flange 130.

For example, in this embodiment, the third flange 134 extends from thethird side 110 of the die pad 104, and in particular, from the thirdoutermost edge 118 of the third side 110 of the die pad 104. The thirdflange 134 also extends away from the first surface 119 of the die pad104. The third flange 134 further includes a third portion 164 coupledto the third side 110 of the die pad 104 and fourth portion 166 coupledto, and extending from the third portion 164. The third and fourthportions 164, 166 may be a single unitary material that is contiguouswith the die pad 104. The fourth portion 166 includes a fourth surface168 with a plane 170 of the fourth surface 168 being at an angle withrespect to the first surface 119.

In some embodiments, the angle of the plane 170 of the fourth surface168 with respect to the first surface 119 is a transverse angle, whilein other embodiments, it is a perpendicular angle. In yet otherembodiments, the angle of the plane 170 of the fourth surface 168 withrespect to the first surface is substantially equivalent to the angle ofthe plane 160 of the third surface 158 with respect to the first surface119. In still further embodiments, the angle of the plane 170 of thefourth surface 168 with respect to the first surface is different fromthe angle of the plane 160 of the third surface 158 with respect to thefirst surface 119. In addition, some embodiments include the die pad 104having only a first flange 130, while other embodiments include the diepad 104 having any combination, including all, of the first, second,third and fourth flanges 130, 132, 134, 136.

FIGS. 2A-F are cross-sectional views of an exemplary method of formingthe leadframe 100. In this embodiment, the method begins in FIG. 2A withthe leadframe 100 comprising a sheet of metal, preferably of copper or acopper alloy, although other known metals, semiconductors, andnonconductive materials may be used. The leadframe 100 has a firstsurface 123 opposite a second surface 125. Then, in FIG. 2B, a firstrecess, trench, or opening 174 and the die pad 104 are formed in thefirst surface 123 of the leadframe 100. The die pad and the first recesscan be formed in a same etching step that removes portions of theleadframe. This forming process forms the second portion 156 of thefirst flange 130, which includes the second portion 156 of the firstflange 130 positioned between the first recess 174 and the die pad 104and extending away from the first surface 119 of the die pad 104.

In FIG. 2C, the die pad 104 and the first flange 130 are separated fromthe plurality of leads 102. The separating process includes forming asecond recess 176 in the second surface 125 of the leadframe 100. Thesecond recess 176 is aligned with the first recess 174 and cooperateswith the first recess 174 to separate the first flange 130 from theplurality of leads 102. In other words, the second recess 176 is alignedwith the first recess 174 and is formed to a depth that removes aremaining portion of the leadframe between the recesses 174, 176, suchthat the first and second recesses 174, 176 define a gap or space 178between the first flange 130 and the plurality of leads 102. A depth ofeach recess 174, 176 may vary, such that a depth of the first recess 174may be greater than a depth of the second recess 176 and vice versa. Thedepths of each recess 174, 176 may also be substantially equivalent.Further, it is to be understood that the forming and separating areaccomplished by any number of available methods, including by a wetchemical etch, a dry etch, laser processing, stamping, or by mechanicalblade, among others.

The forming and separating process described above results in the firstflange 130 having a first portion 154 coupled to the die pad 104. Asnoted above, the first portion 154 is coupled to the die pad 104 at thefirst outermost edge 114 of the first side 106 of the die pad 104. Thefirst flange 130 further includes the second portion 156 having thethird surface 158. After forming the first and second surfaces 123, 125and separating the die pad 104 and the flange 130 from the leads 102,the first flange 130 is bent towards a center of the die pad 104, as inFIG. 2D.

The bending includes forming the cavity or space 162 adjacent the firstportion 154 of the first flange 130. The bending also includes a portion180 connecting the die pad 104 to the first flange 130 having a curvedshape. In an embodiment, the bending is accomplished by a stampingmachine, although other methods of bending are possible. The bendingfurther includes positioning the plane 160 of the third surface 158 ofthe second portion 156 of the first flange 130 at an angle with respectto the first surface 119 of the die pad. In an embodiment, the anglebetween the plane 160 of the third surface 158 with respect to the firstsurface 119 of the die pad 104 is a transverse angle, while in yet otherembodiments, the angle is between an 85 and 90 degree angle.

FIG. 2E shows a further step in the method where the die 140 is coupledto the first surface 119 of the die pad 104 with the glue or tape 142.However, it is to be understood that in other embodiments, the die 140is coupled to the die pad 104 at earlier stages in the method describedherein. For example, in separate embodiments, the die 140 is coupled tothe die pad 104 in FIG. 2B, in FIG. 2C, or in FIG. 2D. Further, in anembodiment, the method ends after FIG. 2D without the die 140 attached.In other words, it is possible to manufacture the leadframe 100 havingthe first flange 130 as in FIG. 2D as a separate unit that is latercombined with the below elements to form the package 138.

As shown in FIG. 2E, once the die 140 is attached to the first surface119 of the die pad 104, the plurality of wires 146 are bonded betweenthe pillars or bumps 148 on the die 140 and the contact pads or lands150 on the plurality of leads 102. Once the wires 146 and the die 140are in place, the molding compound 152 is formed on the die 140, thewires 146, the plurality of leads 102, the first flange 130 and theleadframe 100 to form the package 138 as in FIG. 2F. For clarity, theleadframe 100 includes the plurality of leads 102, the die pad 104 andthe first flange 130. The molding compound 152 is also in the cavity 162adjacent the first portion 154 of the first flange 130. As such, themolding compound 152 completely surrounds the first flange 130,including being under a base 182 of the first flange 130 as well as in aspace 184 bounded by a curved sidewall 186 of the first flange 130 andthe first surface 119 of the die pad 104.

Although the method described in the embodiment above only describesforming the first flange 130 in detail, one of skill in the art willappreciate that the same method can be utilized to form the second,third, and fourth flanges 132, 134, and 136 on the second, third, andfourth edges 108, 110, 112, respectively, of the die pad 104.

FIG. 3 shows a cross-sectional view of an alternative exemplaryembodiment of the present disclosure including a leadframe 200 having adie pad 204 spaced from a plurality of leads 202. The die pad 204includes a first side 210 having a first outermost edge 214 and a secondside 212 having a second outermost edge 216. The die pad furtherincludes a first surface 218 opposite a second surface 220. A firstflange 206 is coupled to the die pad 204 and extends from the first side210 of the die pad 204 and away from the first surface 218 of the diepad 204. The first flange 206 includes a first portion 222 and a secondportion 224 extending from the first portion 222. The first portion 222of the first flange 206 is coupled to the die pad 204 adjacent the firstside 210, and in an embodiment, at the first outermost edge 214 of thefirst side 210 of the die pad 204. The second portion includes a thirdsurface 226. In this embodiment, a plane 228 of the third surface 226 issubstantially perpendicular to the first surface 218 of the die pad 204,such as at an angle with respect to the first surface 218 of the die padbetween 85 and 95 degrees.

As such, the first flange 206 includes a first sidewall 230 having athird portion 236 with a first curved shape and a second sidewall 232having a fourth portion 238 having a second curved shape. The firstcurved shape defines a first cavity 234 adjacent the first portion 222of the first flange 206 and the second curved shape defines a secondcavity 240 bounded by the second sidewall 232 and the first surface 218of the die pad 204.

After the leadframe 200 is formed, a die 242 is coupled to the firstsurface 218 of the die pad 204 by a tape or glue 246. Then, a pluralityof wires 248 are bonded between pillars or bumps 250 on the die 242 andcontact pads 252 on the plurality of leads 202. Finally, a moldingcompound 254 is formed over the plurality of wires 248, the leadframe200, the leads 202, the die pad 204, the first flange 206, the secondflange 208, and the die 242 to form a package 256. In the package 256,the molding compound 254 occupies the first cavity 234 and the secondcavity 240. Further, the molding compound 254 completely surrounds thefirst flange 206 and the second flange 208, including the first andsecond sidewalls 230, 232 of the first flange 206. Although the detailsof the second flange 208 are not explained in detail herein, it is to beappreciated that the second flange 208 can include identical features tothat of the first flange 206. Further, a third and fourth flange may beformed as described in earlier embodiments, each having similar featuresas the first and second flanges 206, 208.

FIG. 4 illustrates a top-down view of an alternative exemplaryembodiment of a leadframe 300 according to the present disclosure havinga first edge 302, a second edge 304, a third edge 306 and a fourth edge308. The leadframe 300 further includes a die pad 310 having a firstsurface 312 opposite a second surface 314 and spaced from a plurality ofleads 301. The plurality of leads 301 are spaced around each edge 302,304, 306, 308 of the leadframe 300, and in some embodiments, spacedequidistant from each other. The die pad 310 is coupled to the edges302, 304, 306, 308 of the leadframe 300 by a plurality of tie bars 316that extend from the die pad 310 to corners 303, 305, 307, 309 of theleadframe 300. The die pad 310 may be electrically isolated from theplurality of leads 301 when the leadframe 300 is incorporated into apackage by removing a portion of the leadframe 300 along each edge 302,304, 306, 308, as described above with reference to FIG. 1A.

The die pad 310 further includes a first side 320, a second side 322, athird side 324, and a fourth side 326. The first side 320 includes afirst peripheral edge 328, the second side 322 includes a secondperipheral edge 330, the third side 324 includes a third peripheral edge332, and the fourth side 326 includes a fourth peripheral edge 334 ofthe die pad 310. A first plurality of flanges 336 are formed along thefirst peripheral edge 328, a second plurality of flanges 338 are formedalong the second peripheral edge 330, a third plurality of flanges 340are formed along the third peripheral edge 332, and a fourth pluralityof flanges 342 are formed along the fourth peripheral edge 334. Each ofthe plurality of flanges 336, 338, 340, 342 are separated from eachother by a recess, grooves, or indentations 344, such that the sides320, 322, 324 and 326 of the die pad 310 have a generally serratedconfiguration or arrangement. The flanges 336, 338, 340, 342 areextensions from the die pad 310 from an inner most edge 311 of therecesses 344. The recesses 344 have generally curved shapes based onformation by etching.

Further, the forming of the leadframe 300 can include forming asdescribed above with reference to the other embodiments. As such,although the recesses 344 have a generally rounded “U” shape, it ispossible to produce other shapes using such processes, such as a roundedtrapezoidal shape with angled sidewalls. The plurality of flanges 336,338, 340, and 342 can also include five flanges per side 320, 322, 324,and 326, or more or less, as needed in for a given application. Finally,each of the flanges 336, 338, 340, and 342 are bent according to themethods described herein, such that when the leadframe 300 isincorporated into a package with molding compound, the molding compoundsurrounds each of the flanges 336, 338, 340, and 342 to anchor themolding compound to the leadframe 300, thus preventing the possibilityof a crack.

FIGS. 5A-D are views of an alternative exemplary embodiment of thepresent disclosure showing a leadframe 400 in various stages ofmanufacturing. The leadframe 400 includes a die pad 404 spaced from aplurality of leads 402. The die pad 404 is coupled to an outer edge 403of the leadframe 400 through a plurality of tie bars 406. The die pad404 includes a first surface 408 opposite a second surface 409, whereinthe first surface 408 is bounded by an outermost edge 401 of the die pad404. The die pad further includes a first side 410, a second side 412, athird side 414, and a fourth side 416. In this embodiment, the outermostedge 401 includes the first side 410 having first outermost edge 418,the second side 412 having a second outermost edge 420, the third side414 having a third outermost edge 422, and the fourth side 416 having afourth outermost edge 424.

A plurality of anchoring posts 426 are formed on the first side 408 ofthe die pad 404 and spaced along the outermost edge 401 of the die pad404. In this embodiment, the plurality of anchoring posts 426 includesat least three anchoring posts 426 positioned on each side 410, 412, 414and 416 of the die pad 404 along the outermost edge 401 of the die pad404. One of skill in the art will understand that the leadframe 400 ofthis embodiment may include less than three anchoring posts 426 perside, or more than three anchoring posts per side depending on theintended application of the leadframe 400.

For example, in an embodiment, the leadframe 400 includes no anchoringposts 426 per side, as described in more detail below, while in otherembodiments, the leadframe 400 includes one, two, three, four, five,six, seven, eight, nine, ten, or more anchoring posts 426 per side. Assuch, various illustrations accompanying the present disclosure mayinclude varying numbers of anchoring posts 426, which is intended toshow that the present disclosure is not limited by the number ofanchoring posts 426 per side. Further, in an embodiment, each of theplurality of anchoring posts 426 are connected together to form asingular, unitary, or integral anchoring ridge along an outer edge ofthe die pad 404, while in other embodiments, successive ones, or pairsof anchoring posts 426 are connected together to form anchoring postswith a generally rectangular shape.

The anchoring posts 426 may be spaced, as in this embodiment,equidistant from each other along the outermost edge 401. However, inother embodiments, different spacing arrangements may be desirable. Inaddition, although the anchoring posts 426 of this embodiment arepositioned such that a second surface 436 of each anchoring post 426 hasan outer edge 438 that aligns with the outermost edge 401, the anchoringposts 426 can be formed with a space between the outer edge 438 of eachpost 436 and the outermost edge 401 of the die pad. The second surface436 of each anchoring post 426 in this embodiment preferably has asquare shape, although the methods described herein allow for formingother shapes, such as a circle, a triangle, a rectangle, or a trapezoid,for example. Further, the second surface 436 of each anchoring post 426has a second thickness 413 that will be described in more detail below.

In addition, the die pad 404 may be electrically isolated from theplurality of leads 402 when the leadframe 400 is incorporated into apackage by removing a portion of the leadframe 400 along the outer edge403, as described above with reference to FIG. 1A.

FIG. 5B is a cross-sectional view of the exemplary embodiment of theleadframe 400 showing the leadframe 400 incorporated into a package 440and the anchoring posts 426 in more detail. The package 440 includes theplurality of leads 402 spaced from the die pad 404, with the die pad 404having the first surface 408 opposite the second surface 409. A die 442is coupled to the first surface 408 of the die pad 404 with a glue ortape 444 and a plurality of wires 426 are bonded between the die 442 andthe leads 402, as described herein. Each of the anchoring posts 426include a first portion 448 and a second portion 450 with a centralportion 452 therebetween. The first portion 448 of each anchoring post426 is coupled to the die pad 404 adjacent the outer edge 401 of the diepad 404. The second portion 450 includes the second surface 436.

In addition, because the anchoring posts 426 are not bent, a space 419between an edge of the die 442 and a post 426 may be smaller than asimilar space between the die and the flange in the above embodiments.As such, the disclosed embodiments that include the posts 426 mayinclude the die 442 having a larger size and shape than the embodimentsincluding flanges. Further, the embodiments disclosed herein do notinclude a cavity under an outer edge of the die pad, which reduces alength and width of the overall package. In other words, package size isreduced in the disclosed embodiments because outer dimensions of the diepad will be less due to the fact that the die pad does not have to beextended in order to provide material in which to form the cavity orspace under the outer edge of the die pad.

Each anchoring post 426 further includes the first portion 448 having afirst thickness 411, the second portion 450 having the second thickness413, and the central portion 452 having a third thickness 415, whereinin this embodiment, the first thickness 411 of the first portion 448 andthe second thickness 413 of the second portion 450 are greater than thethird thickness 415 of the central portion 452. However, one familiarwith the forming processes described herein will appreciate that thesethicknesses may vary in other embodiments due to the depth of the etch,or other forming methods. For example, the first thickness 411 may begreater than the second thickness 413 and the central thickness 415, thesecond thickness 413 may be greater than the first thickness 411 and thecentral thickness 415, or the central thickness 415 may be greater thanthe first thickness 411 and the second thickness 413 of the respectiveportions 448, 450, 452 of each anchoring post 426. Further, thethicknesses 411, 413, 415 may vary between posts 426, depending on themasking and etching process, or other forming process, used to form theposts 426.

FIGS. 5A-B further show that the second surface 436 of each anchoringpost 426 is flat and planar. Although not illustrated, it is to befurther understood that the forming process can include creating arounded second surface 436. In addition, in this embodiment, the secondsurface 436 of each anchoring post 426 is coplanar with a surface 417 ofeach lead 402. In this embodiment, the surface 417 of each lead 402 isan upper surface, or more specifically, a top, or uppermost surface. Tocomplete the package 440, a molding compound 454 is formed over the die442, the wires 446, and the leadframe 400, which includes the leads 402,the die pad 404, and the anchoring posts 426. The molding compound 454completely surrounds each of the anchoring posts 426, such that first,second, and third curved edges 456, 458, 460 of each anchoring post 426form a tight bond with the molding compound 454 and thus effectivelyseals the package 440.

FIG. 5C illustrates a partial perspective view of the leadframe 400showing the plurality of anchoring posts 426 in more detail and aportion of one of the plurality of tie bars 406 extending from the diepad 404. In particular, the second surface 436 of each anchoring post isclearly shown as flat and planar. Further, the leadframe 400 includesthe first curved edge 456 and each anchoring post 426 aligned along theouter edge 401, with successive anchoring posts 426 spaced equidistantfrom each other. One of skill in the art will appreciate that the curvedsides 456, 458, 460 of the anchoring posts 426 may be formed by anetching procedure. Further, FIG. 5C illustrates the leadframe 400 andthe die pad 404 having at least five anchoring posts 426 per side.

In addition, each anchoring post 426 includes the first and secondportions 448, 450 with the first portion 448 being adjacent the outeredge 401 and the second portion 450 being adjacent the second surface436. The central portion 452 is positioned between the first and secondportions 448, 450, wherein the thickness of the first and secondportions 448, 450 is greater than the thickness of the central portion.In other words, each anchoring post 426 includes a plurality of concaveregions formed along a height of the post 426 between the first andsecond portions 448, 450. However, because FIG. 6 is a perspective view,only a first concave region 462 and a second concave region 464 arevisible. In an embodiment, each side of each anchoring post 426 includessuch a concave region, wherein each concave region has similar, orequivalent, curvature formed by etching each side of each post 426 tosubstantially the same depth. In other embodiments, the concave regions462, 464 are different because the depth of the etch is different.

FIG. 5D is a partial cross-sectional view of one of the plurality of tiebars 406 showing the connection between the tie bar 406 and the die pad404 in more detail. The die pad 404 includes a thickness 423 extendingbetween the first and second surfaces 408, 409. Similarly, the tie bar406 includes a thickness 405 between first and second surfaces 427, 429of the tie bar 406. As illustrated, the thickness 423 of the die pad 404is equivalent to the thickness 405 of the tie bar 406, although in otherembodiments, the thicknesses 423, 405 are different. For example, in anembodiment, the thickness 423 of the die pad 404 is less than thethickness 405 of the tie bar 406, while in other embodiments, thethickness 423 of the die pad 404 is greater than the thickness 405 ofthe tie bar 406.

When the first surface of the leadframe 400 is etched or otherwiseprocessed to form the die pad 404 and other features of the presentdisclosure, as described above with reference to FIGS. 2A-F, a firstcurved region 421 is formed at the interface between the tie bar 406 andthe die pad 404. In other words, the first curved region 421 extendsbetween the first surface 427 of the tie bar 406 and the first surface408 of the die pad 404. Similarly, when a second surface of theleadframe 400 is etched to form the first curved surface 456 (FIG. 5C)and other features described herein, a second curved region 425 isformed between the second surface 429 of the tie bar 406 and the secondsurface 409 of the die pad 404 where the tie bar 406 is coupled to thedie pad 404.

Further, it is to be understood that although the cross-sectional viewof the tie bar 406 described herein illustrates only the first curvedregion 421 adjacent the die pad 404, a similar curved region may beformed opposite the first curved region 421, such that a portion 431(FIG. 5C) of the tie bar 406 adjacent the die pad 404 ends in a point,or edge, with curved regions 421 on either side of the point of edge.

When the leadframe 400 is incorporated into a package, the first andsecond curved regions 421, 425 function similarly to the anchoring posts426 described herein to form a tight bond between molding compound thatwill surround each curved region 421, 425 in the package. In anembodiment, each of the plurality of tie bars 406 includes similarcurved regions 421, 425. In other embodiments, the leadframe 400 doesnot include any anchoring posts 426, but rather, the seal between themolding compound and the leadframe 400 when the leadframe 400 isincorporated into a package is accomplished solely with the curvedregions 421, 425 of each tie bar 406.

It is to be further appreciated that in an embodiment, an anchoring post426 is formed in close proximity to, or adjacent, each tie bar 406. Thisarrangement may be particularly useful in applications where highstresses occur at the corners of a package, as both the anchoring post426 and the tie bar 406 at each corner will assist in forming a tightbond or seal between molding compound that surrounds each post 462 andtie bar 406 when the leadframe 400 is incorporated in a package, asdescribed above. In other embodiments, the portion 431 of the tie bar406 adjacent the die pad 404 may have dimensions similar to each of theanchoring posts 426, such that an anchoring post 426 is formed at eachcorner of the die pad 404, and each such corner anchoring post 426 isconnected to the tie bar 406, either through a tapered, or a rectilineartransition. One of skill in the art will appreciate that sucharrangements, shapes, and orientations of the tie bar 406 are possiblethrough the etching processes referenced herein.

The first curved region 421 is further defined by a first outermost edge428 and the second curved region 425 is defined by a second outermostedge 430. The first and second outermost edges 428, 430 are spaced fromeach other by a first distance 432. The first surface 427 of the tie bar406 and the second surface 409 of the die pad 404 are spaced from eachother by a second distance 407. In an embodiment, the first distance 432and the second distance 407 are equivalent such that the interfacebetween the tie bar 406 and the die pad 404 has a substantially squarecross-section. In other embodiments, the first distance 432 is greaterthan, or less than, the second distance 407. One of skill in the artwill also understand that while not specifically illustrated in theinterest of brevity, the tie bars describe herein with reference toother embodiments, for example in FIGS. 1A and 4, include similarfeatures, such that tie bars of the present disclosure further aid informing a tight seal between molding compound and the leadframesdisclosed herein when the leadframes are incorporated into packages.

As will be readily appreciated from the foregoing, the presentdisclosure achieves a leadframe that reduces the possibility of apackage crack by providing anchoring flanges or posts along an edge ofthe leadframe. Each of the disclosed embodiments provides a solution tothe above described issues with packages by increasing the leadframesurface area in contact with the molding compound in a package, therebyincreasing bond strength between the molding compound and the leadframe.In particular, each of the flanges and anchoring posts described hereinare completely surrounded by the molding compound when incorporated intoa package, which prevents the leadframe from unilaterally expanding andcontracting. Instead, the molding compound being on all sides of theflanges and anchoring posts freezes such members in place, therebylimiting motion due to expansion and contraction during use and reducingthe possibility of delamination at edges of the die pad.

Further, even if a crack were to form in the embodiments of the presentdisclosure, the raised flanges or anchoring posts act as a wall orbarrier inside the package that force the contaminants to overcomegravitational or other forces and to travel a longer path in order tocome into contact with sensitive components, thereby preventing packagefailure even in the event that delamination occurs.

Although not bent, the anchoring posts achieve a similar solution,whereby anchoring posts, or tie bars with similar features as anchoringposts, can be formed in high stress areas of the leadframe, such as atthe corners of the die pad, in order to provide additional leadframematerial for the molding compound to bond with and thus, form a strongerbond that is more capable of resisting the stronger forces present inthose areas to reduce the possibility of delamination.

In addition, the disclosed embodiments benefit from deeper formingprocesses in order to form larger flanges or anchoring posts and also donot require a cavity formed under an outer edge of the die pad, thusallowing for thinner die pads to be created, which reduces overallpackage size. In other words, because the disclosed embodiments do notinclude a cavity under an outer edge of the die pad, a length and widthof the die pad along the outer edge can be reduced because the extra diepad material to support the formation of the cavity is no longernecessary, thus resulting in smaller overall packages.

The various embodiments described above can be combined to providefurther embodiments. All of the U.S. patents, U.S. patent applicationpublications, U.S. patent applications, foreign patents, foreign patentapplications and non-patent publications referred to in thisspecification and/or listed in the Application Data Sheet areincorporated herein by reference, in their entirety. Aspects of theembodiments can be modified, if necessary to employ concepts of thevarious patents, applications and publications to provide yet furtherembodiments.

These and other changes can be made to the embodiments in light of theabove-detailed description. In general, in the following claims, theterms used should not be construed to limit the claims to the specificembodiments disclosed in the specification and the claims, but should beconstrued to include all possible embodiments along with the full scopeof equivalents to which such claims are entitled. Accordingly, theclaims are not limited by the disclosure.

1. A method, comprising: forming a first recess and a die pad in a firstsurface of a leadframe, the forming including defining a flange, theflange positioned between the first recess and the die pad and extendingfrom a surface of the die pad; separating the die pad and the flangefrom a plurality of leads, the separating including: forming a secondrecess in a second surface of the leadframe, the second recess alignedwith the first recess and cooperating with the first recess to separatethe flange from the plurality of leads, the flange having a firstportion coupled to the die pad and a second portion, the second portionhaving a third surface; bending the flange toward a center of the diepad after forming the first and second surfaces, the bending includingforming a cavity adjacent the first portion of the flange.
 2. The methodof claim 1, further comprising: coupling a die to the die pad; bondingone or more wires between the die and the plurality of leads; andforming a molding compound on the die, the wires, the plurality ofleads, and the leadframe, the molding compound being in the cavityadjacent the first portion of the flange.
 3. The method of claim 1,wherein forming the first and second surfaces includes forming using awet etch, a dry etch, a laser, stamping or a mechanical blade.
 4. Themethod of claim 1, wherein bending the flange further includespositioning a plane of the third surface at an angle with respect to thesurface of the die pad.
 5. The method of claim 4, wherein positioningthe plane of the third surface at an angle with respect to the surfaceof the die pad includes positioning the plane of the third surface at atransverse angle with respect to the surface of the die pad.
 6. Themethod of claim 4, wherein positioning the plane of the third surface atan angle with respect to the surface of the die pad includes positioningthe plane of the third surface at a perpendicular angle with respect tothe surface of the die pad.
 7. The method of claim 1, wherein a depth ofthe first recess is greater than a depth of the second recess.
 8. Amethod, comprising: forming a die pad having a first thickness, a firstflange integral the die pad having a second thickness greater than thefirst thickness, and a lead of a leadframe, forming the die pad, thefirst flange, and the lead of the leadframe including: forming a firstrecess extending into a first surface of the leadframe terminatingbefore extending to a second surface of the leadframe opposite to thefirst surface; and separating the lead from the die pad and the firstflange by forming a second recess extending into the second surface ofthe leadframe to the first recess and aligning the second recess withthe first recess.
 9. The method of claim 8, wherein: forming the firstrecess includes forming a first portion of the first flange integral thedie pad; and forming the second recess includes forming a second portionof the first flange integral the die pad and extending from the firstflange to the die pad.
 10. The method of claim 8, further comprisingbending the first flange toward a center of the die pad after formingthe first and second portion of the first flange, the bending includingforming a cavity adjacent the first portion of the first flange.
 11. Themethod of claim 8, further comprising bending the first flange toward acenter of the die pad after forming the first flange, the bendingincluding forming a cavity adjacent the first portion of the firstflange.
 12. The method of claim 9, wherein forming the first flangeintegral the die pad further includes forming the first flange extendingsubstantially from a first corner of the die pad to a second corner ofthe die pad.
 13. The method of claim 8, wherein forming the die padfurther includes forming a second flange integral the die pad having thesecond thickness and being opposite to the first flange.
 14. The methodof claim 13, further comprising coupling a die to a third surface of thedie pad between the first flange and the second flange.
 15. The methodof claim 14, further comprising forming a molding compound covering thefirst flange, the die pad, the lead, and the die.
 16. A method,comprising: forming a die pad of a leadframe; and forming a plurality offirst flanges along a first edge of the die pad, forming the pluralityof first flanges including: spacing adjacent ones of the plurality offirst flanges from each other separating each respective first flange ofthe plurality of first flanges from each other.
 17. The method of claim16, further comprising: forming a plurality of second flanges at asecond side of the die pad opposite to the first edge, forming theplurality of second flanges including: spacing adjacent ones of theplurality of second flanges from each other separating each respectivesecond flange of the plurality of second flanges from each other. 18.The method of claim 17, wherein: separating each of the respective firstflanges of the plurality of first flanges further includes formingrespective first indentations of a plurality of first indentationsbetween adjacent ones of the plurality of first flanges; and separatingeach of the respective second flanges of the plurality of second flangesfurther include forming respective second indentations of a plurality ofsecond indentations between adjacent ones of the plurality of secondflanges.
 19. The method of claim 16, further comprising: forming aplurality of second flanges at a second edge of the die pad transverseto the first edge of the die pad, forming the plurality of secondflanges including: spacing adjacent ones of the plurality of secondflanges from each other separating each respective second flange of theplurality of second flanges from each other.
 20. The method of claim 16,wherein separating each of the respective first flanges of the pluralityof first flanges further includes forming respective first indentationsof a plurality of first indentations between adjacent ones of theplurality of first flanges.